DocumentCode :
2279586
Title :
Modeling of profile effects for large area inductive coupled plasma sources
Author :
DiPezo, G. ; Parker, G.J. ; Vitello, P.
Author_Institution :
Lawrence Livermore Nat. Lab., CA, USA
fYear :
1995
fDate :
5-8 June 1995
Firstpage :
168
Abstract :
Summary form only given, as follows. Inductively coupled plasma (ICP) sources are one of the most important high density plasma configurations developed in recent years. Next generation technology requires plasma processing systems with high uniformity over very large areas. We present here results of a comparison between computer modeling and experimental data from the LLNL Large Area ICP Source. The LLNL Source has a 30" diameter and is designed to study 400 mm processing. Computer simulations using the fluid code, INDUCT94, are used to explain variations in the plasma density profile measurements as a function of inductive power, gas pressure, and gas composition. Both argon and N/sub 2/ discharges are considered. INDUCT94 solves the 2D time-dependent fluid equations for electrons, ions, and neutrals including effects of both inductive and capacitive coupling. Detailed volume and surface chemistry reactions are treated. We discuss the effect of pressure and power on the plasma uniformity. High uniformity of the order of several per cent was found to be possible over a 400 mm diameter area.
Keywords :
plasma density; plasma diagnostics; plasma production; plasma simulation; 2D time-dependent fluid equations; Ar; Ar discharges; INDUCT94; N/sub 2/; N/sub 2/ discharges; capacitive coupling; computer modeling; computer simulations; fluid code; gas composition; gas pressure; high density plasma configurations; inductive coupling; inductive power; large area inductive coupled plasma sources; next generation technology; plasma density profile measurements; plasma processing systems; plasma uniformity; profile effects; surface chemistry reactions; volume reactions; Computer simulation; Density measurement; Plasma chemistry; Plasma density; Plasma materials processing; Plasma measurements; Plasma simulation; Plasma sources; Power measurement; Power system modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science, 1995. IEEE Conference Record - Abstracts., 1995 IEEE International Conference on
Conference_Location :
Madison, WI, USA
ISSN :
0730-9244
Print_ISBN :
0-7803-2669-5
Type :
conf
DOI :
10.1109/PLASMA.1995.531636
Filename :
531636
Link To Document :
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