Title :
Novel solder-on-pad (SoP) technology for fine-pitch flip chip bonding
Author :
Choi, Kwang-Seong ; Choo, Sun-Woo ; Lee, Jong-Jin ; Sung, Ki-Jun ; Bae, Hyun-Chel ; Lim, Byeong-Ok ; Moon, Jong-Tae ; Eom, Yong-Sung
Author_Institution :
Electron. & Telecommun. Res. Inst., Daejeon, South Korea
Abstract :
Solder-on-pad (SoP) technology gives the fine-pitch flip chip bonding manufacturability and reliability. For the SoP technology with pitch equal to or less than 150 μm pitch, there are many candidates. The cost-effectiveness will be one of the major criteria determining the industry preference. A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology (SoP) of the fine pitch flip chip bonding. With this material, the solder bump array was successfully formed with pitch of 150 μm in one direction.
Keywords :
bonding processes; copper alloys; flip-chip devices; silver alloys; solders; tin alloys; SnAgCu; bumping material; fine-pitch flip chip bonding manufacturability; fine-pitch flip chip bonding reliability; maskless solder-on-pad technology; resin; solder bump array; Flip chip; Heating; Packaging; Powders; Resins; Substrates;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582689
