• DocumentCode
    227965
  • Title

    Understanding parasitic effects to improve the “3ω” measurement of GaN HEMTs thermal impedance

  • Author

    Mustafa, Albara ; Raphael, Sommet ; Guillaume, Callet ; Teyssier, Jean-Pierre ; Raymond, Quere

  • Author_Institution
    XLIM Univ. de Limoges, Brive-la-Gaillarde, France
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    942
  • Lastpage
    946
  • Abstract
    The thermal impedance of Gallium Nitride based High Electron Mobility Transistors (GaN HEMTs) has been characterized using the “3ω method”. The method was initially proposed by D.G. Cahill to measure the thermal conductivity of bulk materials or layers. We already demonstrated in a previous work that under certain conditions the voltage oscillation at the third harmonic is the real image of the thermal impedance of the device in the frequency domain. In this work, we propose both a theoretical approach to understand the limitation of our 3ω test bench and a comparison with measurements.
  • Keywords
    III-V semiconductors; gallium compounds; high electron mobility transistors; semiconductor device measurement; thermal conductivity measurement; thermal management (packaging); wide band gap semiconductors; 3ω measurement; GaN; HEMT; frequency domain; gallium nitride; high electron mobility transistors; parasitic effects; thermal conductivity measurement; thermal impedance; third harmonic; voltage oscillation; Frequency measurement; Gallium nitride; HEMTs; Harmonic analysis; Impedance; Impedance measurement; MODFETs; 3ω method; GaN HEMTs; characterization; thermal impedance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892383
  • Filename
    6892383