Title :
A new heat flux coupled combustion model of sandwich propellant with complex gas reaction kinetics
Author :
Zhi-qing, Zhou ; Yue-cheng, Yang
Author_Institution :
Xi´´an Res. Inst. of Hi-tech, Xi´´an, China
Abstract :
This paper proposed a new heat flux coupled combustion model of sandwich propellant, a modified 37 species and 127 reactions kinetics mechanism was utilized to describe combustion flame in gas phase; a simple arrhenius pyrolyis law was used to calculate mass flux of oxidizer and binder constitute, initial species fraction released from burning surface was determined by experimental data, an “equivalent source term method” was applied to describe surface decomposition via pyrolysis relations; steady heat conduction equation was solved in inert solid phase. This model adopted full-coupled way of heat flux to determine temperature of burning surface and burning rate, then 2-D heat conduction behavior in solid phase was considered. Numerical studies have been conducted on 2-D AP(ammonium perchlorate)/HTPB(hydroxylterminated polybutadiene) sandwich models, and the flame structure, the temperature and temperature gradient along burning surface, and burning rate characteristics were discussed.
Keywords :
chemically reactive flow; combustion; flames; heat conduction; numerical analysis; propellants; pyrolysis; 2-D ammonium perchlorate-hydroxylterminated polybutadiene sandwich model; arrhenius pyrolyis law; burning rate characteristics; burning surface temperature; combustion flame analysis; complex gas reaction kinetics; equivalent source term method; flame structure; heat conduction behavior; heat flux coupled combustion model; mass flux calculation; numerical method; reaction kinetics mechanism; sandwich propellant; steady heat conduction equation; temperature gradient; Combustion; Fires; Heating; Kinetic theory; Propulsion; Solids; Temperature; combustion; complex reaction kinetics; heat flux coupled; sandwich; simulation;
Conference_Titel :
Computer Science and Automation Engineering (CSAE), 2011 IEEE International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-8727-1
DOI :
10.1109/CSAE.2011.5952660