A study to performance of electroplating solder bump in assembly

Author

Wang, Mu-Chun ; Huang, Kuo-Shu ; Hsieh, Zhen-Ying ; Yang, Hsin-Chia ; Liu, Chuan-Hsi ; Lin, Chii-Ruey

Author_Institution

Dept. of Electron. Eng., Ming-Hsin Univ. of Sci. & Technol., Hsinchu, Taiwan

fYear

2010

fDate

16-19 Aug. 2010

Firstpage

794

Lastpage

797

Abstract

The electroplating methodology in assembly is better than the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging), especially in quality. Through eight-step process requiring one photolithographic mask, the pre-WLCSP procedures for the electroplating solder bump technology are able to be completed. Comparing this technology with the electroplating gold bump technology, the cost in the previous is more impressive even though the performance of this technology is little lower than the last. Therefore, in this study, the electroplating solder bump in assembly was probed in detail to analyze the possibility of mass-production.

Keywords

assembling; chip scale packaging; electroplating; solders; wafer level packaging; assembly; electroplating solder bump; pre-WLCSP; stencil printing manufacturing; wafer-level chip-scale packaging; Assembly; Gold; Materials; Packaging; Passivation; Printing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-8140-8

Type

conf

DOI

10.1109/ICEPT.2010.5582692

Filename

5582692