Title :
A study to performance of electroplating solder bump in assembly
Author :
Wang, Mu-Chun ; Huang, Kuo-Shu ; Hsieh, Zhen-Ying ; Yang, Hsin-Chia ; Liu, Chuan-Hsi ; Lin, Chii-Ruey
Author_Institution :
Dept. of Electron. Eng., Ming-Hsin Univ. of Sci. & Technol., Hsinchu, Taiwan
Abstract :
The electroplating methodology in assembly is better than the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging), especially in quality. Through eight-step process requiring one photolithographic mask, the pre-WLCSP procedures for the electroplating solder bump technology are able to be completed. Comparing this technology with the electroplating gold bump technology, the cost in the previous is more impressive even though the performance of this technology is little lower than the last. Therefore, in this study, the electroplating solder bump in assembly was probed in detail to analyze the possibility of mass-production.
Keywords :
assembling; chip scale packaging; electroplating; solders; wafer level packaging; assembly; electroplating solder bump; pre-WLCSP; stencil printing manufacturing; wafer-level chip-scale packaging; Assembly; Gold; Materials; Packaging; Passivation; Printing;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582692
