DocumentCode :
2279726
Title :
Impact of hygroswelling and vapor pressure on delamination
Author :
Zhao, Shufeng ; Chen, Xu ; Yao, Jinzhong
Author_Institution :
Freescale Semicond. Inc., Tianjin
fYear :
2006
fDate :
6-8 Dec. 2006
Firstpage :
773
Lastpage :
780
Abstract :
In this paper, resolving methods for several key issues in simulation of interface delamination of plastic package under temperature and humidity environment are discussed. Structural model of plastic package under temperature and humidity is constructed, and the coupling of the thermal and moisture impact on structure field is implemented. The method of determining the vapor pressure in crack during process of solder reflow is presented. The precondition processes of moisture absorption and solder reflow of a real package are simulated, and the results of finite element model are analyzed with mixed mode fracture and interface cracking.
Keywords :
delamination; finite element analysis; fracture; plastic packaging; reflow soldering; surface cracks; swelling; vapour pressure; finite element model; hygroswelling; interface cracking; interface delamination; mixed mode fracture cracking; moisture absorption; moisture impact; plastic packaging; solder reflow; vapor pressure; Absorption; Delamination; Electronic packaging thermal management; Finite element methods; Heat transfer; Humidity; Moisture; Plastic packaging; Semiconductor device modeling; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location :
Singapore
Print_ISBN :
1-4244-0664-1
Electronic_ISBN :
1-4244-0665-X
Type :
conf
DOI :
10.1109/EPTC.2006.342810
Filename :
4147339
Link To Document :
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