Challenges and potentials with SiP using FC on LTCC

Author

Noren, M. ; Brunner, S. ; Hoffmann, C. ; Salz, W. ; Block, C.

Author_Institution

EPCOS OHG, SAW MLIP MO T, Deutschlandsberg

fYear

2006

fDate

6-8 Dec. 2006

Firstpage

806

Lastpage

809

Abstract

The current trend towards miniaturization and higher power dissipation offers new challenges for a system in package. This leads to new combinations of materials with different physical properties, processes and designs. (Brunner, 2005) One example of this development is the PAiD-module (power amplifier with integrated duplexer) where a power amplifier is mounted together with a SAW-filter (surface acoustic wave) on a module. The filter characteristic of a SAW-filter is highly temperature depending and therefore the thermal management of the power amplifier must be well controlled. In this paper the impact on thermal performance and reliability of underfill, heat spreader, thermalvias and LTCC (low temperature cofired ceramic) design are discussed

Keywords

ceramic packaging; flip-chip devices; system-in-package; thermal management (packaging); LTCC; SAW-filter; SiP; heat spreader; low temperature cofired ceramic design; power amplifier with integrated duplexer; surface acoustic wave filter; system in package; thermal management; thermalvias; Acoustic materials; Acoustic waves; Filters; Packaging; Power amplifiers; Power dissipation; Process design; Surface acoustic waves; Temperature dependence; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference, 2006. EPTC '06. 8th

Conference_Location

Singapore

Print_ISBN

1-4244-0664-1

Electronic_ISBN

1-4244-0665-X

Type

conf

DOI

10.1109/EPTC.2006.342815

Filename

4147344