Design of a directional coupler using three layer microstrip structure

Author

Chun, Dong Wan ; Shin, Chull Chai

Author_Institution

Dept. of Electron. Eng., Ajou Univ., Suwon, South Korea

Volume

1

fYear

2001

fDate

2001

Firstpage

165

Abstract

A modified re-entrant mode coupler using a three-layer microstrip substrate is proposed and the design method is presented in this paper. The proposed structure is constructed by adding one layer and then placing a floating conductor on top of this layer in the conventional re-entrant mode coupler. We have designed the coupler from the calculated characteristic impedances, effective permittivities, and coupling coefficients, which are obtained by using even-odd mode analysis. The proposed coupler has approximately 2 dB tighter coupling than the re-entrant mode coupler and also shows good performance in VSWR, isolation, and differential phase characteristics

Keywords

coupled mode analysis; electric impedance; method of moments; microstrip directional couplers; permittivity; 1.5 GHz; VSWR; characteristic impedances; coupling coefficients; design method; differential phase characteristics; directional coupler design; effective permittivities; even-odd mode analysis; floating conductor; isolation; modified re-entrant mode coupler; three-layer microstrip substrate; Capacitance; Conductors; Coupling circuits; Design methodology; Dielectric substrates; Directional couplers; Impedance; Microstrip; Nonhomogeneous media; Wide area networks;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2001. APMC 2001. 2001 Asia-Pacific

Conference_Location

Taipei

Print_ISBN

0-7803-7138-0

Type

conf

DOI

10.1109/APMC.2001.985613

Filename

985613