DocumentCode :
227987
Title :
Parametric evaluation of foster RC-network for predicting transient evolution of natural convection and radiation around a flat plate
Author :
Merrikh, Ali Akbar ; McNamara, Andrew J.
Author_Institution :
Thermal Mech. Packaging Eng., Adv. Micro Devices, Austin, TX, USA
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
1011
Lastpage :
1018
Abstract :
Compact thermal modeling of hand-held and ultra-low power microelectronic systems has recently attracted a great deal of attention. In this study time-dependent evolution of heat transfer around a flat plate was numerically investigated. The flat plate is subjected to internal heat generation from the inner boundary via a discrete heat source. It is cooled on the outer boundary via buoyancy and radiation. The main objective of this work was to understand the limitation of a Foster RC-network in predicting transient behavior of a non-linear system as such. Non-linearity of the system stems from the physics of flow and heat transfer evolution around the flat plate, resulting time- and power-dependent boundary conditions. Special attention was paid to the characteristics and number of the network ladders for resolving the time-history of the temperature as a function of the input power. The studied system resembles a hand-held, fanless, device operating at room ambient.
Keywords :
RC circuits; micromechanical devices; natural convection; plates (structures); Foster RC-network; buoyancy; compact thermal modeling; discrete heat source; flat plate; hand-held microelectronic systems; heat transfer evolution; internal heat generation; network ladders; nonlinear system; power-dependent boundary conditions; radiation; time-dependent boundary conditions; time-dependent evolution; time-history; transient behavior; ultra-low power microelectronic systems; Accuracy; Approximation methods; Equations; Heat transfer; Heating; Mathematical model; Transient analysis; Foster RC-network; compact thermal model; fanless systems; flat plate; natural convection and radiation; ther mal influence coefficients; transient heat transfer;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
ISSN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2014.6892392
Filename :
6892392
Link To Document :
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