DocumentCode
2279934
Title
Current density and hot spot prediction using electrical-thermal co-simulation for multi-layer IC packages
Author
Chee-Hoe, Lin ; Wui-Weng, Wong ; Bao-Min, Liu
Author_Institution
Adv. Micro Devices (Singapore) Pte Ltd., Singapore
fYear
2006
fDate
6-8 Dec. 2006
Firstpage
849
Lastpage
852
Abstract
Hot spot occurrence in integrated circuit (IC) packages is common nowadays as current density in the package increases. While electrical and thermal models are constructed to tackle the problem, however the models are loosely coupled between electrical and thermal phenomena. This paper derives an electrical-thermal co-simulation methodology that is validated by measurement on temperature distribution and hot spots in multi-layer IC packages.
Keywords
current density; integrated circuit packaging; temperature distribution; current density; electrical-thermal co-simulation; hot spot prediction; integrated circuit packages; multilayer IC packages; temperature distribution; Computational modeling; Conducting materials; Current density; Current distribution; Current measurement; Density measurement; Electric variables measurement; Electrical resistance measurement; Integrated circuit packaging; Magnetic field measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2006. EPTC '06. 8th
Conference_Location
Singapore
Print_ISBN
1-4244-0664-1
Electronic_ISBN
1-4244-0665-X
Type
conf
DOI
10.1109/EPTC.2006.342823
Filename
4147352
Link To Document