Title :
Advanced liquid cooling for a traction drive inverter using jet impingement and microfinned enhanced surfaces
Author :
Waye, Scot K. ; Narumanchi, Sreekant ; Mihalic, Mark ; Moreno, Gines ; Bennion, Kevin ; Jeffers, John
Author_Institution :
Nat. Renewable Energy Lab., Golden, CO, USA
Abstract :
This study evaluates a jet impingement based cooling strategy combined with microfinned enhanced surfaces as a means of improving thermal management for power electronic devices. For comparison, a baseline channel flow heat exchanger and jet impingement on plain surfaces are characterized. The jets, augmented with enhanced microfinned surfaces, provide localized cooling to areas heated by the insulated-gate bipolar transistors and diode devices. Lighter materials and simpler manufacturing while managing required pumping power increase the overall performance while reducing weight, volume, and cost. Computational fluid dynamics modeling validated by experiments was used to characterize the baseline as well as jet-impingement-based heat exchangers at typical automotive flow rates using a 50%-50% mixture by volume of water and ethylene glycol. The three cooling configurations were tested at full inverter power (40 to 100 kW output power) on a dynamometer. An increased thermal performance was observed for the jet-impingement configurations. Experiments were also performed to investigate the long-term reliability of the jets impinging on enhanced surfaces.
Keywords :
computational fluid dynamics; cooling; heat exchangers; invertors; jets; thermal management (packaging); baseline channel flow heat exchanger; computational fluid dynamics modeling; diode devices; dynamometer; ethylene glycol; insulated-gate bipolar transistors; jet impingement based cooling strategy; localized cooling; long-term reliability; microfinned enhanced surfaces; power electronic devices; thermal management; traction drive inverter; typical automotive flow rates; Cooling; Heating; Inverters; Prototypes; Surface resistance; Thermal resistance; enhanced surfaces; heat transfer; inverter thermal management; jet-impingement; microfinned surfaces; power electronics; single-phase liquid cooling;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
DOI :
10.1109/ITHERM.2014.6892399