DocumentCode :
228007
Title :
Thermal management of an IGBT module using two-phase cooling
Author :
Malu, Neha ; Bora, Dhiraj ; Nakanekar, Satej ; Tonapi, Sandeep
Author_Institution :
Anveshak Technol. & Knowledge Solutions, Pune, India
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
1079
Lastpage :
1085
Abstract :
A lot of effort has been put to develop the next generation cooling technologies for Insulated Gate Bipolar Transistor module of hybrid vehicles. Two phase cooling has been identified as a potential solution for cooling of such modules. This paper explores the viability and implementation of a two phase cooling scheme and its comparison with single phase cooling. For this inverter module of Toyota Prius consisting of 12 pairs of IGBT devices and diodes is used. Thermal simulation technique is used to study the effect of convective heat transfer coefficient, cold plate dimensions, total power on IGBT, thermal interface material and its thickness on the thermal performance of the module.
Keywords :
automotive electronics; cooling; insulated gate bipolar transistors; invertors; semiconductor device packaging; thermal management (packaging); IGBT module; Toyota Prius; convective heat transfer coefficient; hybrid vehicles; insulated gate bipolar transistor module; inverter module; next generation cooling; thermal interface material; thermal management; thermal simulation; two-phase cooling; Cold plates; Conductivity; Heat transfer; Insulated gate bipolar transistors; Inverters; IGBT; Two-phase cooling; thermal management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
ISSN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2014.6892401
Filename :
6892401
Link To Document :
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