Thermal management of an IGBT module using two-phase cooling

Author

Malu, Neha ; Bora, Dhiraj ; Nakanekar, Satej ; Tonapi, Sandeep

Author_Institution

Anveshak Technol. & Knowledge Solutions, Pune, India

fYear

2014

fDate

27-30 May 2014

Firstpage

1079

Lastpage

1085

Abstract

A lot of effort has been put to develop the next generation cooling technologies for Insulated Gate Bipolar Transistor module of hybrid vehicles. Two phase cooling has been identified as a potential solution for cooling of such modules. This paper explores the viability and implementation of a two phase cooling scheme and its comparison with single phase cooling. For this inverter module of Toyota Prius consisting of 12 pairs of IGBT devices and diodes is used. Thermal simulation technique is used to study the effect of convective heat transfer coefficient, cold plate dimensions, total power on IGBT, thermal interface material and its thickness on the thermal performance of the module.

Keywords

automotive electronics; cooling; insulated gate bipolar transistors; invertors; semiconductor device packaging; thermal management (packaging); IGBT module; Toyota Prius; convective heat transfer coefficient; hybrid vehicles; insulated gate bipolar transistor module; inverter module; next generation cooling; thermal interface material; thermal management; thermal simulation; two-phase cooling; Cold plates; Conductivity; Heat transfer; Insulated gate bipolar transistors; Inverters; IGBT; Two-phase cooling; thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on

Conference_Location

Orlando, FL

ISSN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2014.6892401

Filename

6892401