Title :
Elasto-plastic analysis of popcorn failure caused by cavitition unstable growth in plastic IC packaging material
Author :
Zhigang, Li ; Guozheng, Yuan ; Xuefeng, Shu
Author_Institution :
Mech. Dept., Taiyuan Univ. of Technol., Taiyuan, China
Abstract :
Popcorn failure in Hyperelastic-plastic electronic packages under thermal load and Moisture is studied. Using the theory of finite deformation, we obtain the analytical relation between void growth and the sum of the vapor pressure induced by moisture and thermal stress induced by heat mismatch. Numerical analyses show that the critical traction decreases with decreases of yield stress-shear modulus ratio when plastic behavior of material is considered. On the other hand the critical traction decreases with increase of the initial porosity when yield stress-shear modulus ratio is given.
Keywords :
deformation; elastoplasticity; integrated circuit packaging; integrated circuit reliability; stress-strain relations; thermal stresses; cavitition unstable growth; critical traction; elasto-plastic analysis; finite deformation; hyperelastic-plastic electronic packages; integrated circuit packaging material; popcorn failure; thermal load; thermal stress; yield stress-shear modulus ratio; Electronic packaging thermal management; Moisture; Plastics; Strain; Stress; Thermal stresses; Cavitition; hyperelastic-plastic material; popcorn failure;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582725
