• DocumentCode
    2280292
  • Title

    A circuit-level substrate current model for smart-power ICs

  • Author

    Conte, Fabrizio Lo ; Sallese, Jean-Michel ; Pastre, Marc ; Krummenacher, François ; Kayal, Maher

  • Author_Institution
    Electron. Lab. (elab.epfl.ch), EPFL, Lausanne, Switzerland
  • fYear
    2009
  • fDate
    20-24 Sept. 2009
  • Firstpage
    3784
  • Lastpage
    3789
  • Abstract
    This paper presents a new modeling methodology accounting for generation and propagation of minority carriers that can be used directly in circuit-level simulators in order to estimate coupled parasitic currents. The model is based on a new compact model of basic components (PN junction and resistance) and takes into account minority carriers at the boundary. An equivalent circuit schematic of the substrate is built by identifying these basic elements in the substrate and interconnecting them. Parasitic effects such as bipolar or latchup result from the continuity of minority carriers guaranteed by the components´ model. A structure similar to a half-bridge perturbing sensitive N-well has been simulated. It is composed by four PN junctions connected together by their common P-doped sides. The results are in good agreement with those obtained from physical device simulations.
  • Keywords
    minority carriers; p-n junctions; power semiconductor devices; semiconductor device models; substrates; P-doped sides; PN junctions; circuit-level simulators; circuit-level substrate current model; coupled parasitic currents; equivalent circuit schematic; half-bridge perturbing sensitive N-well; minority carriers; smart-power IC; Smart power IC; integrated circuit; lumped modeling; methodology modeling; noise; parasitic coupling; power parasitic modeling; power semiconductor devices; substrate modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    978-1-4244-2893-9
  • Electronic_ISBN
    978-1-4244-2893-9
  • Type

    conf

  • DOI
    10.1109/ECCE.2009.5316405
  • Filename
    5316405