DocumentCode
2280292
Title
A circuit-level substrate current model for smart-power ICs
Author
Conte, Fabrizio Lo ; Sallese, Jean-Michel ; Pastre, Marc ; Krummenacher, François ; Kayal, Maher
Author_Institution
Electron. Lab. (elab.epfl.ch), EPFL, Lausanne, Switzerland
fYear
2009
fDate
20-24 Sept. 2009
Firstpage
3784
Lastpage
3789
Abstract
This paper presents a new modeling methodology accounting for generation and propagation of minority carriers that can be used directly in circuit-level simulators in order to estimate coupled parasitic currents. The model is based on a new compact model of basic components (PN junction and resistance) and takes into account minority carriers at the boundary. An equivalent circuit schematic of the substrate is built by identifying these basic elements in the substrate and interconnecting them. Parasitic effects such as bipolar or latchup result from the continuity of minority carriers guaranteed by the components´ model. A structure similar to a half-bridge perturbing sensitive N-well has been simulated. It is composed by four PN junctions connected together by their common P-doped sides. The results are in good agreement with those obtained from physical device simulations.
Keywords
minority carriers; p-n junctions; power semiconductor devices; semiconductor device models; substrates; P-doped sides; PN junctions; circuit-level simulators; circuit-level substrate current model; coupled parasitic currents; equivalent circuit schematic; half-bridge perturbing sensitive N-well; minority carriers; smart-power IC; Smart power IC; integrated circuit; lumped modeling; methodology modeling; noise; parasitic coupling; power parasitic modeling; power semiconductor devices; substrate modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Energy Conversion Congress and Exposition, 2009. ECCE 2009. IEEE
Conference_Location
San Jose, CA
Print_ISBN
978-1-4244-2893-9
Electronic_ISBN
978-1-4244-2893-9
Type
conf
DOI
10.1109/ECCE.2009.5316405
Filename
5316405
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