• DocumentCode
    228046
  • Title

    Simulating the evaporation of pinned water microdroplets with implementation of a surface concentration distribution

  • Author

    Gleason, Kevin ; Putnam, Shawn A.

  • Author_Institution
    Dept. of Mech. & Aerosp. Eng., Univ. of Central Florida, Orlando, FL, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    1222
  • Lastpage
    1227
  • Abstract
    Numerical and experimental investigations of water microdroplet evaporation on polymer substrates are reported. The study is focused on validating numerical models with experimental data. The experimentally measured evaporation rates are compared to the predictions of a commonly reported model based on a solution of the Laplace equation, providing the local evaporation flux along the droplets liquid-vapor interface. The model consistently overpredicts the evaporation rate, which is presumable due to the models constant saturated vapor concentration along the droplets liquid-vapor interface. In result, a modified version of the model is implemented to account for variations in temperature along the droplets liquid-vapor interface. A vapor concentration distribution is then imposed using this temperature distribution, increasing the accuracy in predicted evaporation rate by ~ 7.7% and ~ 9.9% for heated polymer substrates at Ts = 50°C and 65°C, respectively.
  • Keywords
    Laplace equations; drops; evaporation; temperature distribution; thermal management (packaging); Laplace equation; droplets liquid-vapor interface; heated polymer substrates; local evaporation flux; numerical models; pinned water microdroplet evaporation; saturated vapor concentration; surface concentration distribution; temperature 50 C; temperature 65 C; temperature distribution; vapor concentration distribution; Cooling; Image edge detection; Predictive models;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892420
  • Filename
    6892420