Accurate, cost effective absolute pressure sensor

Author

Suzuki, Yoshitaka ; Kudo, Takahiro ; Ikeda, Kyoichi

Author_Institution

Micromachining Lab., Yokogawa Electr. Corp., Nagano, Japan

Volume

2

fYear

1997

fDate

16-19 Jun 1997

Firstpage

1493

Abstract

An accurate, cost effective absolute pressure sensor is presented. The sensor chip has a single crystal silicon diaphragm and a vacuum cavity that is fabricated by micromachining technology using SOI wafers. The vacuum cavity works as a protector against overrange pressure. The measurement range is 170 kPa abs., and the fracture pressure is over 12 MPa, 70 times the measurement range. The sensor chip also has a simple stress isolating structure which reduces the stress caused by gluing it to the package. Though the sensor chip is mounted directly on plastic or a metal base with an adhesive agent, high accuracy and stability are realized. And this structure is highly cost effective

Keywords

elemental semiconductors; microsensors; packaging; pressure sensors; silicon; silicon-on-insulator; 12 MPa; 170 kPa; SOI wafers; Si; Si diaphragm; Si-Si₃N₄; Si-SiO₂; absolute pressure sensor; accuracy; cost effectiveness; fracture pressure; metal base; micromachining technology; overrange pressure; package; plastic base; sensor chip; stability; stress isolating structure; vacuum cavity; Costs; Isolation technology; Micromachining; Packaging; Pressure measurement; Protection; Semiconductor device measurement; Silicon; Stress; Vacuum technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on

Conference_Location

Chicago, IL

Print_ISBN

0-7803-3829-4

Type

conf

DOI

10.1109/SENSOR.1997.635748

Filename

635748