Analysis on the abilities of solder joints to resist thermal fatigue and service life prediction

Author

Yang, Xuexia ; Wang, Bo ; Zhang, Yu ; Shu, Xuefeng

Author_Institution

Inst. of Appl. Mech. & Biomed. Eng., Taiyuan Univ. of Technol., Taiyuan, China

fYear

2010

fDate

16-19 Aug. 2010

Firstpage

1147

Lastpage

1150

Abstract

The purpose of this paper is to compare the abilities of two kinds of solder joints (63Sn37Pb and 96.5Sn3.0Ag0.5Cu) to resist thermal fatigue, and to predict their thermal fatigue lives. First, ten 2D simplified models of PBGA (Plastic Ball Grid Array package) structure with different shape of solder joints, which are obtained from surface mount experiments, are established using finite element software. Then, the stress-strain response of solder joints is obtained. Finally, according to the modified Coffin-Manson´s empirical formula, the thermal fatigue lives of solder joint above mentioned are predicted. The result shows the fatigue life of lead-free solder joints is as 3.5 times as SP solder joints´.

Keywords

ball grid arrays; copper alloys; finite element analysis; lead alloys; plastic packaging; silver alloys; solders; thermal stress cracking; tin alloys; 2D simplified models; SnAgCu; SnPb; finite element software; lead-free solder joints; modified Coffin-Manson´s empirical formula; plastic ball grid array package structure; service life prediction; stress-strain response; surface mount experiments; thermal fatigue; Electronic packaging thermal management; Electronics packaging; Fatigue; Plastics; Shape; Soldering; Strain;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on

Conference_Location

Xi´an

Print_ISBN

978-1-4244-8140-8

Type

conf

DOI

10.1109/ICEPT.2010.5582747

Filename

5582747