Title :
Analysis on the abilities of solder joints to resist thermal fatigue and service life prediction
Author :
Yang, Xuexia ; Wang, Bo ; Zhang, Yu ; Shu, Xuefeng
Author_Institution :
Inst. of Appl. Mech. & Biomed. Eng., Taiyuan Univ. of Technol., Taiyuan, China
Abstract :
The purpose of this paper is to compare the abilities of two kinds of solder joints (63Sn37Pb and 96.5Sn3.0Ag0.5Cu) to resist thermal fatigue, and to predict their thermal fatigue lives. First, ten 2D simplified models of PBGA (Plastic Ball Grid Array package) structure with different shape of solder joints, which are obtained from surface mount experiments, are established using finite element software. Then, the stress-strain response of solder joints is obtained. Finally, according to the modified Coffin-Manson´s empirical formula, the thermal fatigue lives of solder joint above mentioned are predicted. The result shows the fatigue life of lead-free solder joints is as 3.5 times as SP solder joints´.
Keywords :
ball grid arrays; copper alloys; finite element analysis; lead alloys; plastic packaging; silver alloys; solders; thermal stress cracking; tin alloys; 2D simplified models; SnAgCu; SnPb; finite element software; lead-free solder joints; modified Coffin-Manson´s empirical formula; plastic ball grid array package structure; service life prediction; stress-strain response; surface mount experiments; thermal fatigue; Electronic packaging thermal management; Electronics packaging; Fatigue; Plastics; Shape; Soldering; Strain;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582747
