DocumentCode
2280696
Title
Interpretation of ICA mechanical cycling data
Author
Morris, J.E. ; Niiranen, Sini ; Mattila, Toni ; McCarthy, Jack
Author_Institution
Dept. of Electr. & Comput. Eng., Portland State Univ., Portland, OR, USA
fYear
2010
fDate
16-19 Aug. 2010
Firstpage
1162
Lastpage
1167
Abstract
Cyclic mechanical shear testing of isotropic conductive adhesives (ICAs) at ambient temperature reveals both viscoelastic behavior and a reproducible stress plateau. The failure mechanism is typically adhesive, rather than cohesive, which leads to significant deviations from the Coffin-Manson behavior expected. Tentative explanations of the visco-elasticity and plateau are offered in terms of filler particle movement and structural layering within the epoxy matrix.
Keywords
conductive adhesives; failure analysis; shear strength; stress analysis; thermal management (packaging); viscoelasticity; Coffin-Manson behavior; ICA mechanical cycling data; ambient temperature; cyclic mechanical shear testing; epoxy matrix; failure mechanism; filler particle movement; isotropic conductive adhesive; reproducible stress plateau; structural layering; viscoelastic behavior; Conductive adhesives; Electronics packaging; Reliability; Strain; Stress; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-8140-8
Type
conf
DOI
10.1109/ICEPT.2010.5582752
Filename
5582752
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