Title :
Interpretation of ICA mechanical cycling data
Author :
Morris, J.E. ; Niiranen, Sini ; Mattila, Toni ; McCarthy, Jack
Author_Institution :
Dept. of Electr. & Comput. Eng., Portland State Univ., Portland, OR, USA
Abstract :
Cyclic mechanical shear testing of isotropic conductive adhesives (ICAs) at ambient temperature reveals both viscoelastic behavior and a reproducible stress plateau. The failure mechanism is typically adhesive, rather than cohesive, which leads to significant deviations from the Coffin-Manson behavior expected. Tentative explanations of the visco-elasticity and plateau are offered in terms of filler particle movement and structural layering within the epoxy matrix.
Keywords :
conductive adhesives; failure analysis; shear strength; stress analysis; thermal management (packaging); viscoelasticity; Coffin-Manson behavior; ICA mechanical cycling data; ambient temperature; cyclic mechanical shear testing; epoxy matrix; failure mechanism; filler particle movement; isotropic conductive adhesive; reproducible stress plateau; structural layering; viscoelastic behavior; Conductive adhesives; Electronics packaging; Reliability; Strain; Stress; Testing;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582752
