DocumentCode :
228073
Title :
Development of an IT equipment lumped capacitance parameter database for transient data center simulations
Author :
Demetriou, Dustin W. ; Erden, Hamza Salih ; Khalifa, H. Ezzat ; Schmidt, Roger R.
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
1330
Lastpage :
1337
Abstract :
The transient behavior of IT equipment can be represented by a lumped thermal capacitance for use in data center level transient thermal simulations. Previous work has proposed a mathematical methodology to extract the necessary lumped capacitance parameters, the server´s time constant and heat transfer effectiveness, via air temperature measurements. This work describes and experimentally tests that proposed methodology to introduce a possible approach for developing an easy-to-use database of lumped capacitance characteristics for use in transient thermal simulations. The database will allow the user to select the appropriate transient parameters based on characteristics that do not require an “autopsy” of each-and-every server in the data center. Experiments are conducted to provide representative transient parameters which classify the servers by mass density and operating air flow rate. The paper describes the experimental methodology in detail to allow for the easy addition of other IT equipment or future server generations.
Keywords :
computational fluid dynamics; computer centres; heat transfer; lumped parameter networks; IT equipment; air flow rate; air temperature measurements; data center; heat transfer effectiveness; lumped capacitance parameter database; lumped thermal capacitance; mass density; thermal time constant; transient thermal simulations; Capacitance; Equations; Heating; Servers; Temperature measurement; Thermal conductivity; Transient analysis; data center; energy efficiency; transient;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location :
Orlando, FL
ISSN :
1087-9870
Type :
conf
DOI :
10.1109/ITHERM.2014.6892434
Filename :
6892434
Link To Document :
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