• DocumentCode
    228073
  • Title

    Development of an IT equipment lumped capacitance parameter database for transient data center simulations

  • Author

    Demetriou, Dustin W. ; Erden, Hamza Salih ; Khalifa, H. Ezzat ; Schmidt, Roger R.

  • Author_Institution
    IBM Corp., Poughkeepsie, NY, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    1330
  • Lastpage
    1337
  • Abstract
    The transient behavior of IT equipment can be represented by a lumped thermal capacitance for use in data center level transient thermal simulations. Previous work has proposed a mathematical methodology to extract the necessary lumped capacitance parameters, the server´s time constant and heat transfer effectiveness, via air temperature measurements. This work describes and experimentally tests that proposed methodology to introduce a possible approach for developing an easy-to-use database of lumped capacitance characteristics for use in transient thermal simulations. The database will allow the user to select the appropriate transient parameters based on characteristics that do not require an “autopsy” of each-and-every server in the data center. Experiments are conducted to provide representative transient parameters which classify the servers by mass density and operating air flow rate. The paper describes the experimental methodology in detail to allow for the easy addition of other IT equipment or future server generations.
  • Keywords
    computational fluid dynamics; computer centres; heat transfer; lumped parameter networks; IT equipment; air flow rate; air temperature measurements; data center; heat transfer effectiveness; lumped capacitance parameter database; lumped thermal capacitance; mass density; thermal time constant; transient thermal simulations; Capacitance; Equations; Heating; Servers; Temperature measurement; Thermal conductivity; Transient analysis; data center; energy efficiency; transient;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892434
  • Filename
    6892434