DocumentCode
228073
Title
Development of an IT equipment lumped capacitance parameter database for transient data center simulations
Author
Demetriou, Dustin W. ; Erden, Hamza Salih ; Khalifa, H. Ezzat ; Schmidt, Roger R.
Author_Institution
IBM Corp., Poughkeepsie, NY, USA
fYear
2014
fDate
27-30 May 2014
Firstpage
1330
Lastpage
1337
Abstract
The transient behavior of IT equipment can be represented by a lumped thermal capacitance for use in data center level transient thermal simulations. Previous work has proposed a mathematical methodology to extract the necessary lumped capacitance parameters, the server´s time constant and heat transfer effectiveness, via air temperature measurements. This work describes and experimentally tests that proposed methodology to introduce a possible approach for developing an easy-to-use database of lumped capacitance characteristics for use in transient thermal simulations. The database will allow the user to select the appropriate transient parameters based on characteristics that do not require an “autopsy” of each-and-every server in the data center. Experiments are conducted to provide representative transient parameters which classify the servers by mass density and operating air flow rate. The paper describes the experimental methodology in detail to allow for the easy addition of other IT equipment or future server generations.
Keywords
computational fluid dynamics; computer centres; heat transfer; lumped parameter networks; IT equipment; air flow rate; air temperature measurements; data center; heat transfer effectiveness; lumped capacitance parameter database; lumped thermal capacitance; mass density; thermal time constant; transient thermal simulations; Capacitance; Equations; Heating; Servers; Temperature measurement; Thermal conductivity; Transient analysis; data center; energy efficiency; transient;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location
Orlando, FL
ISSN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2014.6892434
Filename
6892434
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