Title :
Cutting Temperature and Force Data Acquisition and Measuring System Design in High Speed Machining
Author :
Zheng, Xiaofeng ; Zeng, Qiyong ; Wu, Kai ; Yu, Zhonghua ; Li, Xiaotong
Author_Institution :
Sch. of Quality & Safety Eng., China Jiliang Univ., Hangzhou, China
Abstract :
In order to measure the dynamic cutting temperature in high speed machining, a new method to prepare multi-layer thin film thermocouple sensor on a ceramic tool was presented. the sensor was fabricated on the ceramic tool´s rake face with the technology of magnetron sputtering, lithography, and plasma enhanced chemical vapor deposition (PECVD) methods. The preparation process of the multi-player thin films was expatiated. The high speed cutting temperature and cutting force data acquisition and measuring system was designed. The type of data acquisition card is ADlink PCI-9118HG. Simple and friendly human-machine interface was programmed with the application of VC++ technology and Tchart controller to achieve real-time data acquisition, display and analysis of high-speed cutting temperature and cutting force. It was concluded from the experiment that the data acquisition and measuring system is easy and flexible to use.
Keywords :
cutting; data acquisition; design engineering; human computer interaction; machining; production engineering computing; temperature measurement; thermocouples; thin film sensors; ADlink PCI-9118HG data acquisition card; PECVD methods; Tchart controller; VC++ technology; ceramic tool rake face; cutting force data acquisition; dynamic cutting temperature measurement; high speed machining; human-machine interface; lithography; magnetron sputtering; measuring system design; multilayer thin film thermocouple sensor; multiplayer thin film preparation process; plasma enhanced chemical vapor deposition methods; Data acquisition; Force measurement; Force sensors; Machining; Plasma measurements; Plasma temperature; Sputtering; Temperature sensors; Thin film sensors; Velocity measurement; Cutting force; Cutting temperature; Data Acquisition; Measuring system; Thin-film thermocouple;
Conference_Titel :
Measuring Technology and Mechatronics Automation (ICMTMA), 2010 International Conference on
Conference_Location :
Changsha City
Print_ISBN :
978-1-4244-5001-5
Electronic_ISBN :
978-1-4244-5739-7
DOI :
10.1109/ICMTMA.2010.774