DocumentCode
2280804
Title
A vertically integrated media-isolated absolute pressure sensor
Author
Goldman, Ken ; Gritt, George ; Baskett, Ira ; Sooriakumar, K. ; Wallace, Dan ; Hughes, Don ; Shah, Mahesh
Author_Institution
Semicond. Products Sector, Motorola Inc., Phoenix, AZ, USA
Volume
2
fYear
1997
fDate
16-19 Jun 1997
Firstpage
1501
Abstract
A novel, media-isolated, temperature-compensated, bulk-micromachined integrated absolute pressure sensor has successfully been developed. The sensor is usable for most applications involving exposure to harsh media, such as fuel vapor seen by manifold absolute pressure (MAP) sensors. Characterization of the device indicates that the devices fabricated meet specifications of a MAP sensor
Keywords
compensation; micromachining; microsensors; piezoresistive devices; pressure sensors; absolute pressure sensor; bulk-micromachined sensor; device characterization; fuel vapor; harsh media exposure; manifold absolute pressure sensor specification; media-isolated pressure sensor; temperature compensation; vertically integrated pressure sensor; Costs; Etching; Glass; Packaging; Piezoresistance; Sensor phenomena and characterization; Temperature sensors; Transducers; Wafer bonding; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on
Conference_Location
Chicago, IL
Print_ISBN
0-7803-3829-4
Type
conf
DOI
10.1109/SENSOR.1997.635750
Filename
635750
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