• DocumentCode
    228084
  • Title

    Carbon nanotube arrays for coupled electromagnetic and thermal management in high power electronics: Influence of microstructuration and stress investigated by IR thermography

  • Author

    Emplit, A. ; Huynen, Isabelle

  • Author_Institution
    ELEN Dept., Univ. Catholique de Louvain, Louvain-la-Neuve, Belgium
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    1379
  • Lastpage
    1384
  • Abstract
    Multifunctional and multistructured materials are currently developed for high power electronics in transportation and aerospace sectors requiring size and weight reduction. In this work, we investigate laser-machined micro patterns of CNT brushes as an alternative to metallic structures for driving simultaneously EM and heat propagation. The thermal response of the CNT array is observed to be sensitive to the microstructured pattern etched in the CNT brush, and to the mechanical stress induced by an incident air flux. Depending on the induced displacement of nanotubes, a temperature change up to 5°C is measured. The movement of the CNT within the array is correlated to the mechanical stress imposed by the incident air flux. The correlation between thermal fluctuation and air flux is indeed assessed through the proper combination of SEM and interferometry imaging with thermography.
  • Keywords
    carbon nanotubes; electromagnetic shielding; infrared imaging; interferometry; laser beam machining; power electronics; scanning electron microscopy; stress effects; thermal management (packaging); CNT brushes; SEM imaging; air flux; carbon nanotube array; coupled electromagnetic-thermal management; high power electronics; infrared thermography; interferometry imaging; laser machined micropattern; microstructuration effect; stress effect; thermal fluctuation; thermal response; Brushes; Etching; Heating; Stress; Substrates; Temperature measurement; carbon nanotubes array; thermography; thermomechanic;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892440
  • Filename
    6892440