• DocumentCode
    228094
  • Title

    Thermoelectric performance model development and validation for a selection and design tool

  • Author

    Nunnally, Thomas ; Pellicone, Devin ; Van Velson, Nathan ; Schmidt, J. ; Desai, T.

  • Author_Institution
    Adv. Cooling Technol., Inc., Lancaster, PA, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    1404
  • Lastpage
    1411
  • Abstract
    A thermal model has been developed to simulate the performance of thermoelectric cooling for two avionics scenarios, where utilizing commercial off the shelf (COTS) components is highly desirable. Modeling predictions were validated through a series of experiments which studied the two scenarios at varying heat loads and heat sink thermal resistances. In these experiments, component temperatures were shown to be reduced by up to 15% with the addition of a thermoelectric cooler. Furthermore, in both scenarios, the model predicted the temperature of the cooled components within 3-10% accuracy. Further development of the model could result in a tool, which is not currently available, for optimizing system performance and determining the applicability of thermoelectric cooling in a given scenario.
  • Keywords
    heat sinks; thermal management (packaging); thermal resistance; thermoelectric cooling; COTS components; commercial off the shelf components; heat loads; heat sink thermal resistances; thermoelectric cooling; thermoelectric performance model; Heat sinks; Resistance heating; Temperature measurement; Thermal resistance; COTS; avionics; thermal management; thermal modeling; thermoelectric cooling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2014.6892444
  • Filename
    6892444