DocumentCode
228094
Title
Thermoelectric performance model development and validation for a selection and design tool
Author
Nunnally, Thomas ; Pellicone, Devin ; Van Velson, Nathan ; Schmidt, J. ; Desai, T.
Author_Institution
Adv. Cooling Technol., Inc., Lancaster, PA, USA
fYear
2014
fDate
27-30 May 2014
Firstpage
1404
Lastpage
1411
Abstract
A thermal model has been developed to simulate the performance of thermoelectric cooling for two avionics scenarios, where utilizing commercial off the shelf (COTS) components is highly desirable. Modeling predictions were validated through a series of experiments which studied the two scenarios at varying heat loads and heat sink thermal resistances. In these experiments, component temperatures were shown to be reduced by up to 15% with the addition of a thermoelectric cooler. Furthermore, in both scenarios, the model predicted the temperature of the cooled components within 3-10% accuracy. Further development of the model could result in a tool, which is not currently available, for optimizing system performance and determining the applicability of thermoelectric cooling in a given scenario.
Keywords
heat sinks; thermal management (packaging); thermal resistance; thermoelectric cooling; COTS components; commercial off the shelf components; heat loads; heat sink thermal resistances; thermoelectric cooling; thermoelectric performance model; Heat sinks; Resistance heating; Temperature measurement; Thermal resistance; COTS; avionics; thermal management; thermal modeling; thermoelectric cooling;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location
Orlando, FL
ISSN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2014.6892444
Filename
6892444
Link To Document