DocumentCode :
2280972
Title :
The effect of drilling parameters on the wicking in high density PCB processing
Author :
Wang, Liquan ; Wu, Fengshun ; Zhou, Longzao ; Liu, Dong ; Gao, Tuanfen ; Jiang, Xuefei
Author_Institution :
State Key Lab. of Mater. Process. & Die & Mould Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2010
fDate :
16-19 Aug. 2010
Firstpage :
1214
Lastpage :
1217
Abstract :
Wicking is one of the important factors that cause the internal short of Printed Circuit Board (PCB), and directly restrict the pitch of holes. In this paper, orthogonal experimental design method is used to study the effect of five drilling parameters on the wicking. The five factors are rotation speed, feeding speed, retracting speed, drill life and stack number. The result shows that the order of the influencing factors is as follows: stack number, drill life rotation speed, retracting speed, feeding speed. It is found that the optimum parameters combination is rotation speed of 150 kr/min, feeding speed of 38 mm/sec, retracting speed of 280 mm/sec, drill life of 1600 hits and stack number of 1 PNL/stack.
Keywords :
drilling; printed circuit design; printed circuits; drill life; drilling parameters; feeding speed; high density PCB processing; printed circuit board; retracting speed; rotation speed; stack number; wicking; Drilling; Electronics packaging; Force; Glass; Packaging; Printed circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
Type :
conf
DOI :
10.1109/ICEPT.2010.5582768
Filename :
5582768
Link To Document :
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