DocumentCode
2280972
Title
The effect of drilling parameters on the wicking in high density PCB processing
Author
Wang, Liquan ; Wu, Fengshun ; Zhou, Longzao ; Liu, Dong ; Gao, Tuanfen ; Jiang, Xuefei
Author_Institution
State Key Lab. of Mater. Process. & Die & Mould Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2010
fDate
16-19 Aug. 2010
Firstpage
1214
Lastpage
1217
Abstract
Wicking is one of the important factors that cause the internal short of Printed Circuit Board (PCB), and directly restrict the pitch of holes. In this paper, orthogonal experimental design method is used to study the effect of five drilling parameters on the wicking. The five factors are rotation speed, feeding speed, retracting speed, drill life and stack number. The result shows that the order of the influencing factors is as follows: stack number, drill life rotation speed, retracting speed, feeding speed. It is found that the optimum parameters combination is rotation speed of 150 kr/min, feeding speed of 38 mm/sec, retracting speed of 280 mm/sec, drill life of 1600 hits and stack number of 1 PNL/stack.
Keywords
drilling; printed circuit design; printed circuits; drill life; drilling parameters; feeding speed; high density PCB processing; printed circuit board; retracting speed; rotation speed; stack number; wicking; Drilling; Electronics packaging; Force; Glass; Packaging; Printed circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-8140-8
Type
conf
DOI
10.1109/ICEPT.2010.5582768
Filename
5582768
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