• DocumentCode
    2280972
  • Title

    The effect of drilling parameters on the wicking in high density PCB processing

  • Author

    Wang, Liquan ; Wu, Fengshun ; Zhou, Longzao ; Liu, Dong ; Gao, Tuanfen ; Jiang, Xuefei

  • Author_Institution
    State Key Lab. of Mater. Process. & Die & Mould Technol., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2010
  • fDate
    16-19 Aug. 2010
  • Firstpage
    1214
  • Lastpage
    1217
  • Abstract
    Wicking is one of the important factors that cause the internal short of Printed Circuit Board (PCB), and directly restrict the pitch of holes. In this paper, orthogonal experimental design method is used to study the effect of five drilling parameters on the wicking. The five factors are rotation speed, feeding speed, retracting speed, drill life and stack number. The result shows that the order of the influencing factors is as follows: stack number, drill life rotation speed, retracting speed, feeding speed. It is found that the optimum parameters combination is rotation speed of 150 kr/min, feeding speed of 38 mm/sec, retracting speed of 280 mm/sec, drill life of 1600 hits and stack number of 1 PNL/stack.
  • Keywords
    drilling; printed circuit design; printed circuits; drill life; drilling parameters; feeding speed; high density PCB processing; printed circuit board; retracting speed; rotation speed; stack number; wicking; Drilling; Electronics packaging; Force; Glass; Packaging; Printed circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-8140-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2010.5582768
  • Filename
    5582768