DocumentCode
228098
Title
[Back cover]
fYear
2014
fDate
27-30 May 2014
Abstract
Presents the back cover page of the proceedings record.
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on
Conference_Location
Orlando, FL, USA
ISSN
1087-9870
Type
conf
DOI
10.1109/ITHERM.2014.6892447
Filename
6892447
Link To Document