Title :
Advanced Deformation Measurements for electronic products at manufacturing & operating temperatures
Author_Institution :
Dept. CT T DE HW 5, Siemens AG, Berlin, Germany
Abstract :
Deformation Measurements under thermo-mechanical load are quick and useful tool to increase the reliability of electronic products and to verify Finite Element Models (FEM). Two Examples demonstrate the advanced use.
Keywords :
electronic products; finite element analysis; reliability; FEM; advanced deformation measurements; electronic products reliability; finite element models; manufacturing; operating temperatures; thermomechanical load; Copper; Finite element methods; Materials; Robustness; Strain; Stress; Temperature measurement;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582776
