Title :
Packaged wireless multisensor module embedded reinforced concrete for monitoring construction characteristics
Author :
Hung, San-Shan ; Chang, Chih-Yuan ; Chang, Hsing-Cheng ; Feng, Hsin-Yi
Author_Institution :
Dept. of Autom. Control Eng., Feng Chia Univ., Taichung, Taiwan
Abstract :
A packaged wireless multisensor module has been developed and used for monitoring variations of temperature and humidity in reinforced concrete (RC). The multisensor (Sensirion, SHT 75) integrated a microprocessor control unit (MCU) and radio frequency integrated circuits (RFIC) for wireless signal transmission was packaged using poly(methyl methacrylate) (PMMA) to protect the module for avoiding alkali-aggregate corrosion from concrete. The temperature and humidity detection by concrete-embedded sensor modules and signal transmission by RFIC were proposed for real-time and long-term wireless monitoring that can prevent RC deformation caused by temperature and moisture-induced shrinkage stresses, stability and durability. A commercial temperature sensor (Pt-100) and a thermal imaging apparatus (Infrascope TVS200EX) were used to calibration. It is easy to perceive the temperature response comparison between the wireless sensor module and Pt-100 when embedded in concrete. Based on the experimental results, the durability and sensing capability of the proposed wireless multisensor module was investigated and found that can survive the concrete corrosion and stresses. Also it was found RF received long-term outputs that can measure temperature and moisture content with high sensitivity, accuracy and repeatability to reflect the variation in RC construction properties effectively.
Keywords :
infrared imaging; radiofrequency integrated circuits; sensor fusion; temperature sensors; wireless sensor networks; construction characteristics; microprocessor control unit; packaged wireless multisensor module embedded reinforced concrete; radio frequency integrated circuits; temperature sensor; thermal imaging apparatus; wireless signal transmission; Concrete; Humidity; Radiofrequency integrated circuits; Temperature measurement; Temperature sensors; Wireless communication; Wireless sensor networks;
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
DOI :
10.1109/ICEPT.2010.5582791