DocumentCode
2281718
Title
Out-of-plane micro-needle arrays using silicon micromachining
Author
Trada, Hiren ; Walsh, Kevin ; Isham, Alex ; Cambron, Scott
Author_Institution
Louisville Univ., KY
fYear
2007
fDate
22-25 March 2007
Firstpage
404
Lastpage
404
Abstract
An array of out-of-plane silicon processed micro-needles has been successfully fabricated using relatively simple fabrication techniques. This abstract describes the methods explored to produce 100-element needle arrays (10times10) on a single die. Applications of the micro-needles include transdermal drug delivery and tissue delivery (during surgery). Two types of needles were fabricated: solid electrode and hollow through-hole. The solid-core micro-needles can be used for painless perforation of the skin layer to increase absorption of drugs through patches. These types are fabricated using only oxidation, dicing and isotropic etching. The hollow versions have more applications for direct delivery of drugs through the skin and require additional steps of lithography and deep reactive ion etch (DRIE).
Keywords
drugs; etching; lithography; micromachining; needles; silicon; deep reactive ion etch; hollow through-hole; isotropic etching; lithography; microneedle arrays; silicon micromachining; solid electrode; tissue delivery; transdermal drug delivery; Drug delivery; Electrodes; Etching; Fabrication; Micromachining; Needles; Silicon; Skin; Solids; Surgery;
fLanguage
English
Publisher
ieee
Conference_Titel
SoutheastCon, 2007. Proceedings. IEEE
Conference_Location
Richmond, VA
Print_ISBN
1-4244-1029-0
Electronic_ISBN
1-4244-1029-0
Type
conf
DOI
10.1109/SECON.2007.342933
Filename
4147463
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