• DocumentCode
    2281718
  • Title

    Out-of-plane micro-needle arrays using silicon micromachining

  • Author

    Trada, Hiren ; Walsh, Kevin ; Isham, Alex ; Cambron, Scott

  • Author_Institution
    Louisville Univ., KY
  • fYear
    2007
  • fDate
    22-25 March 2007
  • Firstpage
    404
  • Lastpage
    404
  • Abstract
    An array of out-of-plane silicon processed micro-needles has been successfully fabricated using relatively simple fabrication techniques. This abstract describes the methods explored to produce 100-element needle arrays (10times10) on a single die. Applications of the micro-needles include transdermal drug delivery and tissue delivery (during surgery). Two types of needles were fabricated: solid electrode and hollow through-hole. The solid-core micro-needles can be used for painless perforation of the skin layer to increase absorption of drugs through patches. These types are fabricated using only oxidation, dicing and isotropic etching. The hollow versions have more applications for direct delivery of drugs through the skin and require additional steps of lithography and deep reactive ion etch (DRIE).
  • Keywords
    drugs; etching; lithography; micromachining; needles; silicon; deep reactive ion etch; hollow through-hole; isotropic etching; lithography; microneedle arrays; silicon micromachining; solid electrode; tissue delivery; transdermal drug delivery; Drug delivery; Electrodes; Etching; Fabrication; Micromachining; Needles; Silicon; Skin; Solids; Surgery;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SoutheastCon, 2007. Proceedings. IEEE
  • Conference_Location
    Richmond, VA
  • Print_ISBN
    1-4244-1029-0
  • Electronic_ISBN
    1-4244-1029-0
  • Type

    conf

  • DOI
    10.1109/SECON.2007.342933
  • Filename
    4147463