DocumentCode :
2281718
Title :
Out-of-plane micro-needle arrays using silicon micromachining
Author :
Trada, Hiren ; Walsh, Kevin ; Isham, Alex ; Cambron, Scott
Author_Institution :
Louisville Univ., KY
fYear :
2007
fDate :
22-25 March 2007
Firstpage :
404
Lastpage :
404
Abstract :
An array of out-of-plane silicon processed micro-needles has been successfully fabricated using relatively simple fabrication techniques. This abstract describes the methods explored to produce 100-element needle arrays (10times10) on a single die. Applications of the micro-needles include transdermal drug delivery and tissue delivery (during surgery). Two types of needles were fabricated: solid electrode and hollow through-hole. The solid-core micro-needles can be used for painless perforation of the skin layer to increase absorption of drugs through patches. These types are fabricated using only oxidation, dicing and isotropic etching. The hollow versions have more applications for direct delivery of drugs through the skin and require additional steps of lithography and deep reactive ion etch (DRIE).
Keywords :
drugs; etching; lithography; micromachining; needles; silicon; deep reactive ion etch; hollow through-hole; isotropic etching; lithography; microneedle arrays; silicon micromachining; solid electrode; tissue delivery; transdermal drug delivery; Drug delivery; Electrodes; Etching; Fabrication; Micromachining; Needles; Silicon; Skin; Solids; Surgery;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SoutheastCon, 2007. Proceedings. IEEE
Conference_Location :
Richmond, VA
Print_ISBN :
1-4244-1029-0
Electronic_ISBN :
1-4244-1029-0
Type :
conf
DOI :
10.1109/SECON.2007.342933
Filename :
4147463
Link To Document :
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