DocumentCode :
2281785
Title :
Experimental research of micro-channel cooler
Author :
Zongshuo, Li ; Xiaojing, Wang ; Dianxiao, Wang ; Jia, Wang
Author_Institution :
Shanghai Univ., Shanghai, China
fYear :
2010
fDate :
16-19 Aug. 2010
Firstpage :
1355
Lastpage :
1358
Abstract :
With the continuously decreasing size and constantly increasing integration of IC chips, the heat flux is increasing rapidly. Many enhancements are proposed in order to increase the thermal conductivity of micro-channels including nano-fluids, special shapes, and two phase flows, etc. This paper explores a new test system to measure the heat transfer performance of micro-channel cooler. Considering the accuracy of the test, materials with lower thermal conductivity is selected to package the cooler, and a DAQ system is set up to collect the test data. It´s found that in most cases laminar flow occur, and some relationships between temperature, pressure, heat flux and mass flow are obtained. And this research proceeds as foundation for the further research work.
Keywords :
cooling; data acquisition; heat transfer; laminar flow; microchannel flow; nanofluidics; thermal conductivity; two-phase flow; DAQ system; IC chips; heat flux; heat transfer performance; laminar flow; mass flow; microchannel cooler; nanofluids; special shapes; thermal conductivity; two phase flows; Coolants; Heat sinks; Heat transfer; Heating; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
Type :
conf
DOI :
10.1109/ICEPT.2010.5582812
Filename :
5582812
Link To Document :
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