Numerical study on thermo-mechanical analysis of LED lighting system by using ceramic materials

According to Solid-State Lighting Manufacturing Roadmap 2009, lower cost and higher reliability are two key necessities for LED lighting. In this paper, an optimization process of thermal design for LED lighting system is carried out from the perspective of system in packaging. Based on the three-dimensional thermo-mechanical model of LED lighting system, the thermal and mechanical performance of LED lighting system is investigated in the normal working status with different materials (ceramic and aluminum). The junction temperature of LED lighting system is 73.602°C and 77.038°C for using the ceramic and aluminum materials respectively. Compared with the ceramic packages, the higher thermo-mechanical stress in the aluminum packages is obtained because of the higher temperature gradient and CTE mismatch. The results suggest that the effective LED packaging materials can greatly improve the thermal dissipation and thermo-mechanical reliability of current high power LED lighting systems.