• DocumentCode
    2282125
  • Title

    Study on parallel scheduling of LED dies measurement and grading

  • Author

    Wu, Tao ; Li, Bin ; Wang, Longwen ; Lin, Kanghua

  • Author_Institution
    Nat. Numerical Control Syst. Eng. Res. Center, Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2010
  • fDate
    16-19 Aug. 2010
  • Firstpage
    1426
  • Lastpage
    1430
  • Abstract
    The light-emitting diode (LED) is the world´s most efficient light source being mass produced today. However, the packaging cost is relatively high, which has been the main factor restricting widespread application of LED lighting. As the LED industry becomes prosperous, short time consumption for single die measurement is particularly concerned by semiconductor manufacturers. Parallel scheduling methods used for speed improvement are put forward. Focusing on the cooperation between tester and prober, techniques on command flow communication between up station and motion control board, simultaneous control of X/Y driven shafts and up driven dovetails, parallel scheduling between testing process and positioning process are discussed in detail. Using these methods, average speed of measurement is improved from 2.5 LED dies per second to 5.2 LED dies per second. With experimental results, it is proved effective and efficient for proposed system. Such method is available for all similar equipments.
  • Keywords
    light emitting diodes; light sources; motion control; parallel processing; semiconductor device packaging; semiconductor device testing; LED dies measurement; LED industry; LED lighting; command flow communication; die grading; dovetails; light source; light-emitting diode; motion control board; packaging cost; parallel scheduling methods; positioning process; semiconductor manufacturers; shafts; short time consumption; single die measurement; speed improvement; testing process; up station; Job shop scheduling; Light emitting diodes; Motion control; Packaging; Semiconductor device measurement; Testing; Time measurement; LED; chip measurement; parallel scheduling; time consumption;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-8140-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2010.5582834
  • Filename
    5582834