DocumentCode :
2282125
Title :
Study on parallel scheduling of LED dies measurement and grading
Author :
Wu, Tao ; Li, Bin ; Wang, Longwen ; Lin, Kanghua
Author_Institution :
Nat. Numerical Control Syst. Eng. Res. Center, Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2010
fDate :
16-19 Aug. 2010
Firstpage :
1426
Lastpage :
1430
Abstract :
The light-emitting diode (LED) is the world´s most efficient light source being mass produced today. However, the packaging cost is relatively high, which has been the main factor restricting widespread application of LED lighting. As the LED industry becomes prosperous, short time consumption for single die measurement is particularly concerned by semiconductor manufacturers. Parallel scheduling methods used for speed improvement are put forward. Focusing on the cooperation between tester and prober, techniques on command flow communication between up station and motion control board, simultaneous control of X/Y driven shafts and up driven dovetails, parallel scheduling between testing process and positioning process are discussed in detail. Using these methods, average speed of measurement is improved from 2.5 LED dies per second to 5.2 LED dies per second. With experimental results, it is proved effective and efficient for proposed system. Such method is available for all similar equipments.
Keywords :
light emitting diodes; light sources; motion control; parallel processing; semiconductor device packaging; semiconductor device testing; LED dies measurement; LED industry; LED lighting; command flow communication; die grading; dovetails; light source; light-emitting diode; motion control board; packaging cost; parallel scheduling methods; positioning process; semiconductor manufacturers; shafts; short time consumption; single die measurement; speed improvement; testing process; up station; Job shop scheduling; Light emitting diodes; Motion control; Packaging; Semiconductor device measurement; Testing; Time measurement; LED; chip measurement; parallel scheduling; time consumption;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
Type :
conf
DOI :
10.1109/ICEPT.2010.5582834
Filename :
5582834
Link To Document :
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