• DocumentCode
    2282308
  • Title

    Identification of significant process parameters in variable frequency microwave curing

  • Author

    Cepeda, Daniel ; Davis, Cleon ; May, Gary

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
  • fYear
    2007
  • fDate
    22-25 March 2007
  • Firstpage
    590
  • Lastpage
    594
  • Abstract
    Variable frequency microwave (VFM) curing of polymer dielectrics can reduce process time compared to conventional thermal methods drastically without compromising intrinsic material properties. However, the interactions that occur during VFM curing are not well understood. This paper presents a statistical experimental design to determine the significance of VFM processing parameters. A D-optimal experiment is performed on samples of polyimide spin-cast on silicon wafers cured in a VFM furnace. During VFM processing, the temperature of the polyimide samples is ramped to a specific temperature and held for a selected amount of time. Temperature calibration is conducted to guarantee accurate temperature exposure. The input variables analyzed are cure time, ramp rate, hold temperature, center frequency, bandwidth, and sweep rate. The output variables of interest are the in-plane and through-plane indices of refraction, birefringence, and the percent of imidization of polyimide. The percent imidization is measured using attenuated total reflection Fourier transform infrared (ATR-FTIR) spectroscopy. Birefringence is derived from the in-plane and through-plane indices of refraction, both of which are measured with a metricon prism coupler. Analysis of variance (ANOVA) is used to determine the input variables with the greatest effect. Cure time is found to be the only significant parameter.
  • Keywords
    Fourier transforms; curing; dielectric materials; furnaces; polymers; analysis of variance; attenuated total reflection Fourier transform infrared spectroscopy; birefringence; intrinsic material properties; polyimide; polymer dielectrics; silicon wafers; temperature calibration; variable frequency microwave curing; Analysis of variance; Birefringence; Curing; Frequency; Infrared spectra; Input variables; Microwave theory and techniques; Polyimides; Polymers; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SoutheastCon, 2007. Proceedings. IEEE
  • Conference_Location
    Richmond, VA
  • Print_ISBN
    1-4244-1029-0
  • Electronic_ISBN
    1-4244-1029-0
  • Type

    conf

  • DOI
    10.1109/SECON.2007.342971
  • Filename
    4147501