DocumentCode :
2282706
Title :
Physical Modeling and Analysis on Improved Endurance Behavior of P-Type Floating Gate NAND Flash Memory
Author :
Lee, ChangHyun ; Fayrushin, Albert ; Hur, Sunghoi ; Park, Youngwoo ; Choi, Jungdal ; Choi, Jeonghyuk ; Chung, Chilhee
Author_Institution :
Semicond. R&D Center, Samsung Electron. Co. Ltd., Hwasung, South Korea
fYear :
2012
fDate :
20-23 May 2012
Firstpage :
1
Lastpage :
4
Abstract :
In this work, we report improved endurance of p-type floating-gate NAND flash cell. The physical model on the endurance and data retention of p-type floating-gate NAND cells is proposed and the model is verified by using device simulation to elucidate the cause that p-type floating gate has better endurance than n-type floating-gate. The hole currents injected from Si substrate begin to participate in erase operation by using p-type floating gate and the contribution of the holes results in more probable hole-trapping and neutralizing the electron trap in a tunnel oxide with cycling stress. Such hole compensation effect is thought to induce better endurance in p-type floating-gate cell than n-type floating gate cell.
Keywords :
NAND circuits; electron traps; elemental semiconductors; flash memories; hole traps; silicon; NAND flash memory; P-type floating gate; Si; Si substrate; cycling stress; electron trap; endurance behavior; hole compensation effect; hole current; hole-trapping; n-type floating-gate; tunnel oxide; Electron traps; Flash memory; Logic gates; Nonvolatile memory; Stress; Tunneling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Memory Workshop (IMW), 2012 4th IEEE International
Conference_Location :
Milan
Print_ISBN :
978-1-4673-1079-6
Type :
conf
DOI :
10.1109/IMW.2012.6213655
Filename :
6213655
Link To Document :
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