Variability-driven buffer insertion considering correlations

In this work, we investigate the buffer insertion problem under process variations. Sub 100-nm fabrication process causes significant variations on many design parameters. We propose a probabilistic buffer insertion method assuming variations on both interconnect and buffer parameters and consider their correlations due to common sources of variation. Our proposed method is compatible with the more accurate DSM wire-delay model, as well as the Elmore delay model. In addition, a probabilistic pruning criterion is proposed to evaluate potential solutions, while considering their correlations. Experimental results demonstrate that considering correlations using the more accurate DSM delay model results in meeting the timing constraint with an average probability of 0.63. However probabilistic buffer insertion ignoring correlations and deterministic methods, meet the timing constraint with an average probability of 0.25 and 0.19 respectively.