• DocumentCode
    2282782
  • Title

    Supply voltage degradation aware analytical placement

  • Author

    Kahng, Andrew B. ; Liu, Bao ; Wang, Qinke

  • Author_Institution
    Dept. of Comput. Sci. & Eng., California Univ., San Diego, CA, USA
  • fYear
    2005
  • fDate
    2-5 Oct. 2005
  • Firstpage
    437
  • Lastpage
    443
  • Abstract
    Increasingly significant power/ground supply voltage degradation in nanometer VLSI designs leads to system performance degradation and even malfunction. Existing techniques focus on design and optimization of power/ground supply networks. In this paper, we propose supply voltage degradation aware placement, e.g., to reduce maximum supply voltage degradation by relocation of supply current sources. We represent supply voltage degradation at a P/G node as a function of supply currents and effective impedances (i.e., effective resistances in DC analysis) in a P/G network, and integrate supply voltage degradation in an analytical placement objective. For scalability and efficiency improvement, we apply random-walk, graph contraction and interpolation techniques to obtain effective resistances. Our experimental results show an average 20.9% improvement of worst-case voltage degradation and 11.7% improvement of average voltage degradation with only 4.3% wirelength increase.
  • Keywords
    VLSI; circuit optimisation; integrated circuit layout; power supply circuits; analytical placement; graph contraction technique; ground supply networks; ground supply voltage degradation; interpolation technique; nanometer VLSI design; power supply networks; power supply voltage degradation; random-walk technique; supply current source relocation; supply voltage degradation aware placement; Current supplies; Degradation; Design optimization; Impedance; Interpolation; Power supplies; Scalability; System performance; Very large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design: VLSI in Computers and Processors, 2005. ICCD 2005. Proceedings. 2005 IEEE International Conference on
  • Print_ISBN
    0-7695-2451-6
  • Type

    conf

  • DOI
    10.1109/ICCD.2005.101
  • Filename
    1524188