Design of high reliability packaging for Fuji High Power Module

Fuji Electric has been involved in efforts to develop innovative power electronics technology, which is crucial for protecting the global environment and the reduction of carbon dioxide emission. 6^th Generation IGBT (V-IGBT) has been developed as a key device for innovative power converters. Recently, demand for High Power application increases in such as the wind-power generation and Traction converter. Therefore Fuji Electric concentrates to develop the 6^th Generation High Power IGBT Module series. The new Fuji High Power Module had applied the high reliability package technologies such as the terminal bonding with ultrasonic welding and newly solder material between DBC and base plate. The new Fuji High Power Module will contribute to make the large capacity power electronics equipment, especially for applications such as line connection inverter for renewal energy system and large capacity AC drive system highly efficient and long life.