Micro flow devices

Micro flow devices such as microvalves, micropumps are introduced from the point of view of the actuating principle. Since such micro now devices have multilevel stack structures of the wafers, the bonding methods play a very important role In the fabrication. The silicon-to-glass and the silicon-to-silicon anodic bonding methods using a sputtered Pyrex glass intermediate layer were studied to realize multilevel stacks. A time-of-flight type flow sensor was fabricated and tested