DocumentCode
2283273
Title
Design methodology for low power, high-speed CMOS devices utilizing SOI technology
Author
Yoshino, A. ; Kumagai, K. ; Kurosawa, S. ; Itoh, H. ; Okumura, K.
Author_Institution
ULSI Device Dev. Lab., NEC Corp., Sagamihara, Japan
fYear
1993
fDate
5-7 Oct 1993
Firstpage
170
Lastpage
171
Abstract
We have compared CMOS gate performances between bulk and SOI structures, using the circuit simulator SPICE with the simplest assumptions. Main results are as follows: (1) We have demonstrated that it is possible to estimate CMOS/SOI performances using the circuit simulator SPICE without any specific physical models for SOI transistors. (2) The reduction effect of the drain parasitic capacitance by the CMOS/SOI technology becomes more remarkable with a decrease in the supply voltage. (3) Just by increasing the channel width of the CMOS/SOI keeping its power consumption equal to that of the CMOS/BULK, the propagation delay time dependence on large load capacitance can be improved dramatically with higher drivability
Keywords
CMOS integrated circuits; SPICE; integrated circuit technology; integrated logic circuits; logic gates; semiconductor-insulator boundaries; silicon; CMOS gate; SOI technology; SOI transistors; SPICE; bulk structures; channel width; circuit simulator; design methodology; drain parasitic capacitance; drivability; load capacitance; low power high-speed CMOS devices; power consumption; propagation delay time; CMOS technology; Circuit simulation; Delay estimation; Design methodology; Energy consumption; Parasitic capacitance; Propagation delay; SPICE; Semiconductor device modeling; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 1993. Proceedings., 1993 IEEE International
Conference_Location
Palm Springs, CA
Print_ISBN
0-7803-1346-1
Type
conf
DOI
10.1109/SOI.1993.344550
Filename
344550
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