DocumentCode :
2283502
Title :
Subthreshold MOSFET conduction model and optimal scaling for deep-submicron fully depleted SOI CMOS
Author :
Yeh, P.C. ; Fossum, J.G.
Author_Institution :
Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
fYear :
1993
fDate :
5-7 Oct 1993
Firstpage :
142
Lastpage :
143
Abstract :
In this paper we present results of a comprehensive study of the subthreshold characteristics of deep-submicron fully depleted SOI MOSFETs, and suggest optimal CMOS scaling rules based on PISCES simulations and two-dimensional analytic modeling for circuit simulation. Measurements reveal that the subthreshold swing S, which is nearly ideal at 60 mV for long-channel fully depleted devices, tends to increase drastically as L is scaled to deep-submicron values. Our previous study showed that the front-surface current contributes to the increased S via gate bias-dependent source/drain charge sharing, which reduces the effective threshold voltage. A more recent study shows that current throughout the SOI film body, including the back surface, tends to overwhelm the front-surface current in the subthreshold region, rendering the drain current less dependent on the front-gate bias and hence increasing S even more
Keywords :
CMOS integrated circuits; circuit analysis computing; insulated gate field effect transistors; integrated circuit technology; semiconductor device models; PISCES simulations; Si; circuit simulation; deep-submicron SOI CMOS; effective threshold voltage; front-gate bias; front-surface current; fully depleted SOI CMOS; gate bias-dependent source/drain charge sharing; optimal CMOS scaling rules; optimal scaling; subthreshold MOSFET conduction model; subthreshold characteristics; subthreshold swing; two-dimensional analytic modeling; Analytical models; CMOS technology; Circuit analysis; Circuit simulation; Electron devices; MOSFET circuits; Predictive models; Semiconductor device modeling; Subthreshold current; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1993. Proceedings., 1993 IEEE International
Conference_Location :
Palm Springs, CA
Print_ISBN :
0-7803-1346-1
Type :
conf
DOI :
10.1109/SOI.1993.344560
Filename :
344560
Link To Document :
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