Bandwidth expansion and slow-wave effect achievement of bond wire interconnection on LTCC substrate

Author

Zhou, Bo ; Sheng, Weixing ; Wang, Hao

Author_Institution

Microwave & Millimeter Wave Lab., Nanjing Univ. of Sci. & Technol., Nanjing, China

fYear

2011

fDate

12-14 Dec. 2011

Firstpage

1

Lastpage

4

Abstract

This paper compares performances of several bandwidth expansion approaches of bond wire interconnection on low temperature co-fired ceramic (LTCC) substrate. Approaches using multiple bond wires match, lumped element match, rectangle stub match, radial stub match, butterfly stubs match and “L” shape gap match are included in the comparison. Moreover, Slow-wave effect constructed with bond wires is also presented and its slow-wave factor improved structure using crossing bond wires is proposed.

Keywords

ceramic packaging; integrated circuit interconnections; lead bonding; system-in-package; L shape gap match; LTCC substrate; bandwidth expansion approaches; bond wire interconnection; butterfly stubs match; low temperature cofired ceramic substrate; lumped element match; multiple bond wires match; radial stub match; rectangle stub match; slow-wave effect achievement; slow-wave factor; Bandwidth; Integrated circuit interconnections; Microwave circuits; Microwave filters; Microwave integrated circuits; Substrates; Wires; Bond wire; LTCC; slow-wave;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE

Conference_Location

Hanzhou

ISSN

2151-1225

Print_ISBN

978-1-4673-2288-1

Electronic_ISBN

2151-1225

Type

conf

DOI

10.1109/EDAPS.2011.6213727

Filename

6213727