DocumentCode :
2283640
Title :
Non-local modeling of impact ionization for optimal device/circuit design in fully depleted SOI CMOS technology
Author :
Krishnan, S. ; Fossum, J.G.
Author_Institution :
Dept. of Electr. Eng., Florida Univ., Gainesville, FL, USA
fYear :
1993
fDate :
5-7 Oct 1993
Firstpage :
114
Lastpage :
115
Abstract :
Deep-submicron, thin fully depleted (TFD) SOI MOSFETs are potentially viable for future ULSI technology, and they also have potential applications in low-power circuits. However as they are aggressively scaled down, premature breakdown and off-state latch, attributed to the parasitic BJT driven by impact-ionization, threaten their viability. Reliable modeling of these effects requires a non-local analysis of impact ionization, as opposed to conventional local-field analyses that tend to over-predict the carrier generation rate. Furthermore, to study the mentioned effects at the circuit level, the models have to be compact while reflecting the underlying device physics. In this paper we describe the development and implementation of a non-local model for impact ionization in fully depleted SOI MOSFETs in both strong and weak inversion, and we discuss application of the device model in our predictive circuit simulator SOISPICE-2 to design optimization of scaled SOI CMOS
Keywords :
CMOS integrated circuits; SPICE; VLSI; circuit analysis computing; impact ionisation; optimisation; semiconductor device models; semiconductor-insulator boundaries; silicon; SOISPICE-2; Si; ULSI technology; carrier generation rate; deep-submicron region; design optimization; device model; fully depleted SOI CMOS technology; impact ionization; low-power circuits; nonlocal modeling; optimal device/circuit design; parasitic BJT; predictive circuit simulator; scaled SOI CMOS; strong inversion; weak inversion; Circuit simulation; Design optimization; Electric breakdown; Impact ionization; Latches; MOSFETs; Physics; Predictive models; Semiconductor device modeling; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1993. Proceedings., 1993 IEEE International
Conference_Location :
Palm Springs, CA
Print_ISBN :
0-7803-1346-1
Type :
conf
DOI :
10.1109/SOI.1993.344570
Filename :
344570
Link To Document :
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