Novel strip EAM with a ring resonator on InP/InGaAsP-MQW

PIC chip refers to the one that has several functional devices based on the same substrate material, which has strong adaptability to environmental factors, such as vibration and temperature. The application of PIC chip in the node and terminal equipment of the optical communication can greatly enhance the equipment´s ratio of performance over the price and reduce the volume. In this paper a three-dimension time domain method is employed as simulation instrument to design the strip EAM with a ring resonator on InP/InGaAsP-MQW, and the chip is produced by applying domestically advanced semi-conductor epitaxial growth and etching techniques, and it has passed the static test, which shows that the modulator has obvious electric absorption effects and the filtering peak of the resonator changes with the variation of offset voltage.