Title :
Silicon on diamond heat sinks by bonding and etch back
Author :
Söderbärg, Anders ; Edholm, Bengt ; Olsson, Jörgen ; Tiensuu, Stefan ; Johansson, Erik
Author_Institution :
Dept. of Technol., Uppsala Univ., Sweden
Abstract :
In this abstract a concept is presented aimed to increase the heat distribution and to reduce the thermal resistance in SOI-devices. This is realized using a combination of fusion bonding and thinning against stopping layers with deposition of poly-crystalline diamond as the buried isolator. Thus, by replacing oxide with diamond, a Silicon-on-Diamond (SOD) structure is formed
Keywords :
diamond; digital simulation; heat sinks; semiconductor device models; semiconductor-insulator boundaries; silicon; wafer bonding; SOD structure; SOI-devices; Si-C; buried isolator; etch back; fusion bonding; heat distribution; heat sinks; poly-crystalline diamond; silicon-on-diamond structure; stopping layers; thermal resistance; Biomembranes; Bonding; Diodes; Etching; Heat sinks; Semiconductor films; Silicon on insulator technology; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
SOI Conference, 1993. Proceedings., 1993 IEEE International
Conference_Location :
Palm Springs, CA
Print_ISBN :
0-7803-1346-1
DOI :
10.1109/SOI.1993.344593
