A low loss 60GHz radio integrating CMOS circuits with LTCC AiP

In this paper, we propose a low loss 60 GHz Radio AiP (Antenna-in-Package) solution for mobile applications. To achieve this low loss AiP, essential passive elements such as transmission lines, transitions, filters and antennas are developed using low temperature co-fired ceramic (LTCC). In order to make packages power efficient, air cavities are inserted; insertion loss is improved by up to 58% for stripline (SL). In order for them to be integrated into mobile devices, planar patch array antennas are developed as 2×1, 2×2, and 4×4 configurations. They show relative gains of 7 dBi, 7 dBi and 14 dBi, and 3 dB beam width of 30°, 36°, and 19°. We deal with interconnection issues with the wire-bonding technique. In conjunction with proper compensation circuits, 0.64dB of insertion loss is realized over the wide bandwidth (53~67 GHz). In order to realize low power 60 GHz radio for mobile applications, an OOK modulator and demodulator are developed in CMOS technology. These can handle the data at Gbps (2 Gbps and 5 Gbps, respectively) speed with low power dissipation (14.4 mW and 14.7 mW, respectively). In the end, we demonstrate a low power 60 GHz Radio AiP solution for video streaming in mobile applications.