DocumentCode
2284222
Title
A Platform-Specific Modeling method for pattern-based coarse-grained component
Author
Feng, Jindan ; Nie, Lanshun ; Zhan, Dechen ; Xu, Xiaofei
Author_Institution
Res. Center of Intell. Comput. for Enterprises & Services, Harbin Inst. of Technol., Harbin, China
Volume
4
fYear
2011
fDate
10-12 June 2011
Firstpage
627
Lastpage
633
Abstract
The coarse-grained component injected with flexibility can improve development efficiency and adaptability of software for enterprises, but it´s difficult to develop because of their complexity. Aiming to quickly develop the component, this paper presents the definition of pattern-based large-grained component called Business Component for short, and a Platform-Specific Model (PSM) of Business Component and its modeling process on J2EE platform. The PSM is composed of the architecture model, configuration model based on adaptable mechanism, and interface model which offers visitation condition to other components. The corresponding modeling process is also proposed through defining the sub-models in BNF. The modeling tool has been developed and applied to produce the PSM in XML. The PSM of Business Component will be transformed and generated to software system. A case study shows that our model provides great theoretical and practical significance to the development software based on large-grained component.
Keywords
Java; XML; business process re-engineering; object-oriented programming; software architecture; software development management; J2EE platform; XML; business component; enterprises; pattern-based coarse-grained component; platform-specific modeling; software adaptability; software architecture; software system; Adaptation models; Business; Layout; Object oriented modeling; Semantics; Software; Unified modeling language; Model Driven Architecture(MDA); PSM; business component; coarse-grained component; enterprise software and applications;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Science and Automation Engineering (CSAE), 2011 IEEE International Conference on
Conference_Location
Shanghai
Print_ISBN
978-1-4244-8727-1
Type
conf
DOI
10.1109/CSAE.2011.5952926
Filename
5952926
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