Preliminary study of 60 GHz air-filled SIW H-plane horn antenna

Author

Fu, Jeffrey S.

Author_Institution

High Speed Intell. Commun. Res. Center, Chang Gung Univ., Taoyuan, Taiwan

fYear

2011

fDate

12-14 Dec. 2011

Firstpage

1

Lastpage

4

Abstract

In this paper, an H-plane substrate integrated waveguide (SIW) 60 GHz horn antenna is designed and studied using flip-chip technology. The SIW horn input reflection coefficient and output radiation at 60 GHz have been simulated for an air-filled, bump-supported substrate of 100 μm thick. Radiation gain has been observed. Coplanar waveguide to microstrip and microstrip line to SIW transitions are also designed for possibly realization of the antenna.

Keywords

antenna radiation patterns; coplanar waveguides; flip-chip devices; horn antennas; microstrip transitions; substrate integrated waveguides; H-plane; air filled SIW; bump supported substrate; coplanar waveguide to microstrip transition; flip-chip technology; frequency 60 GHz; horn antenna; microstrip line to SIW transition; radiation gain; reflection coefficient; size 100 mum; substrate integrated waveguide; Bandwidth; Dielectric constant; Flip chip; Gallium arsenide; Horn antennas; Substrates; H-plane horn antenna; millimeter wave; on-chip antenna; substrate integrated waveguide (SIW);

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE

Conference_Location

Hanzhou

ISSN

2151-1225

Print_ISBN

978-1-4673-2288-1

Electronic_ISBN

2151-1225

Type

conf

DOI

10.1109/EDAPS.2011.6213765

Filename

6213765