Title :
Preliminary study of 60 GHz air-filled SIW H-plane horn antenna
Author_Institution :
High Speed Intell. Commun. Res. Center, Chang Gung Univ., Taoyuan, Taiwan
Abstract :
In this paper, an H-plane substrate integrated waveguide (SIW) 60 GHz horn antenna is designed and studied using flip-chip technology. The SIW horn input reflection coefficient and output radiation at 60 GHz have been simulated for an air-filled, bump-supported substrate of 100 μm thick. Radiation gain has been observed. Coplanar waveguide to microstrip and microstrip line to SIW transitions are also designed for possibly realization of the antenna.
Keywords :
antenna radiation patterns; coplanar waveguides; flip-chip devices; horn antennas; microstrip transitions; substrate integrated waveguides; H-plane; air filled SIW; bump supported substrate; coplanar waveguide to microstrip transition; flip-chip technology; frequency 60 GHz; horn antenna; microstrip line to SIW transition; radiation gain; reflection coefficient; size 100 mum; substrate integrated waveguide; Bandwidth; Dielectric constant; Flip chip; Gallium arsenide; Horn antennas; Substrates; H-plane horn antenna; millimeter wave; on-chip antenna; substrate integrated waveguide (SIW);
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE
Conference_Location :
Hanzhou
Print_ISBN :
978-1-4673-2288-1
Electronic_ISBN :
2151-1225
DOI :
10.1109/EDAPS.2011.6213765
