DocumentCode :
2284296
Title :
An extraction-free circuit simulator of linear complexity guided by electromagnetics-based first principles
Author :
He, Qing ; Chen, Duo ; Jiao, Dan
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fYear :
2011
fDate :
12-14 Dec. 2011
Firstpage :
1
Lastpage :
4
Abstract :
The prevailing circuit simulation paradigm heavily relies on extraction to perform circuit simulation. In addition, no linear complexity has been reported by existing circuit simulation approaches. In this work, we develop a circuit simulator that bypasses the step of extraction. It produces an RLC (resistor-inductor-capacitor) representation of the linear network without any numerical computation. Such a representation is inherently passive and stable. In addition, it allows for the simulation of a circuit including both nonlinear devices and the linear network in linear complexity. The proposed circuit simulator rigorously captures the coupling between nonlinear circuits and the linear network. As an added bonus, it possesses electromagnetic-physics based accuracy. Application to very large-scale on-chip circuits involving close to 1 million CMOS transistors and interconnects having hundreds of millions of unknowns has demonstrated the superior performance of the proposed extraction-free circuit simulator.
Keywords :
CMOS integrated circuits; VLSI; capacitors; circuit simulation; inductors; integrated circuit interconnections; resistors; CMOS transistors; circuit simulation paradigm; coupling; electromagnetic-physics; electromagnetics-based first principles; extraction-free circuit simulator; interconnects; linear complexity; linear network; nonlinear circuits; resistor-inductor-capacitor representation; very large-scale on-chip circuits; Circuit simulation; Complexity theory; Computational modeling; Integrated circuit modeling; Mathematical model; Nonlinear circuits; RLC circuits; Circuit simulation; electromagnetic analysis; linear complexity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE
Conference_Location :
Hanzhou
ISSN :
2151-1225
Print_ISBN :
978-1-4673-2288-1
Electronic_ISBN :
2151-1225
Type :
conf
DOI :
10.1109/EDAPS.2011.6213766
Filename :
6213766
Link To Document :
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