Title :
Silicon-based on-chip antenna design for millimeter-wave/THz applications
Author :
Hou, Debin ; Xiong, Yong-Zhong ; Hong, Wei ; Goh, Wang Ling ; Chen, Jixin
Author_Institution :
State Key Lab. of Millimeter Waves, Southeast Univ., Nanjing, China
Abstract :
In this paper, three high-gain on-chip antennas are proposed using three different silicon-based technologies in the millimeter-wave/THz frequency range. A modified Vivaldi antenna is first implemented using the micro-fabricated floating process. In the proposed process, the top metal layer is supported by metal vias, separating it from the silicon substrate for low-loss application. The antenna gain of 5.5 dBi is obtained with 78% radiation efficiency. A monopole antenna is subsequently designed using the silicon-benzocyclobutene (Si-BCB) process, with micro-machined backed cavity for high efficiency and wideband application. The simulated gain of this antenna is 6 dBi with 88% radiation efficiency. Our third proposed on-chip antenna is fabricated using commercial 0.18-Hm CMOS technology. The antenna gain and efficiency are improved by the dielectric resonator on the surface of the antenna. The measured gain is 2.7 dBi with radiation efficiency of 43% The three proposed antennas with different silicon compatible processes are therefore suitable for application in the millimeter-wave/THz integrated circuits.
Keywords :
CMOS integrated circuits; broadband antennas; millimetre wave antennas; monopole antennas; silicon; terahertz waves; CMOS technology; Si; Vivaldi antenna; dielectric resonator; high-gain on-chip antennas; low-loss application; microfabricated floating process; millimeter-wave-THz applications; millimeter-wave-THz frequency range; millimeter-wave-THz integrated circuits; monopole antenna; radiation efficiency; silicon substrate; silicon-based on-chip antenna design; silicon-based technologies; silicon-benzocyclobutene; size 0.18 mum; wideband application; Antenna measurements; Dielectric resonator antennas; Dielectrics; Gain; Silicon; System-on-a-chip;
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE
Conference_Location :
Hanzhou
Print_ISBN :
978-1-4673-2288-1
Electronic_ISBN :
2151-1225
DOI :
10.1109/EDAPS.2011.6213767