DocumentCode :
2284377
Title :
PCB trace modeling and equalizer design method for 10 Gbps backplane
Author :
Muraoka, Satoshi ; Shinkai, Go ; Yagyu, Masayoshi ; Uematsu, Yutaka ; Ogihara, Masao ; Sezaki, Naohiro ; Osaka, Hideki
Author_Institution :
Yokohama Res. Lab., Hitachi Ltd., Yokohama, Japan
fYear :
2011
fDate :
12-14 Dec. 2011
Firstpage :
1
Lastpage :
4
Abstract :
This paper discusses accurate PCB modeling methods for 10 Gbps differential signal traces. We added two approaches to the conventional modeling method: (1) We simulated the glass cloth and epoxy distribution in the PCB dielectric to simulate common/differential mode conversion noise (SCD21). (2) We applied a frequency-dependent dielectric constant to the electromagnetic analysis model based on a Djordjevic-Sarkar model to introduce a frequency-dependent group delay. Applying these two additional modeling elements, we obtained accurate SCD21 and jitter properties consistent with measurement results. We also demonstrated an equalizer design based on the improved PCB model. By flattening the frequency dependence of the group delay as well as trace losses for the transmission paths, including the equalizer, by adjusting the properties of the peaking amplifier for the equalizer circuit, we reduced jitter by up to 10 ps for 10 Gbps signalling.
Keywords :
equalisers; printed circuit design; Djordjevic-Sarkar model; PCB dielectric; PCB equalizer design method; PCB trace modeling; SCD21; bit rate 10 Gbit/s; common-differential mode conversion noise; differential signal traces; electromagnetic analysis model; epoxy distribution; equalizer circuit; frequency dependence; frequency-dependent group delay; glass cloth; jitter properties; peaking amplifier properties; transmission paths; Backplanes; Delay; Equalizers; Frequency dependence; Glass; Noise; Permittivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 IEEE
Conference_Location :
Hanzhou
ISSN :
2151-1225
Print_ISBN :
978-1-4673-2288-1
Electronic_ISBN :
2151-1225
Type :
conf
DOI :
10.1109/EDAPS.2011.6213769
Filename :
6213769
Link To Document :
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