• DocumentCode
    2284584
  • Title

    Comprehensive modeling of plasma source ion implantation

  • Author

    Kissick, M.W. ; Blanchard, J.P. ; Callen, J.D. ; Conrad, J.R. ; Malik, S. ; Sridharan, K.

  • Author_Institution
    Dept. of Nucl. Eng. & Eng. Phys., Wisconsin Univ., Madison, WI, USA
  • fYear
    1995
  • fDate
    5-8 June 1995
  • Firstpage
    203
  • Abstract
    Summary form only given, as follows. The modeling effort in both the short and long term involves the combination of models (modules) for all the principal physics in the PSII process including the chamber and modulator circuit, plasma dynamics, implantation, profiles of micro-material changes and stoichiometry, macro-material changes and measurables. The short term effort concentrates on 1-D modeling of Knoop hardness for a paradigm system: N/spl rarr/Ti. These results are compared to experimental data. The long term goal is the development of a suite of codes linked at run time with an object-oriented scheme in concert with a database of runs. The vision is to provide users with a recipe for PSII processes with adjustable levels of description. The database will allow for judicial selection of inputs for runs and experiments based on previous run outputs. Also discussed are ideas for unique physics studies of high dose rate effects in semiconductor doping and ideas for modeling these effects; the potentially high dose rates available with the pulsed nature of PSII can provide unique spatial control of the amorphous layer produced during implantation in semiconductors.
  • Keywords
    ion implantation; plasma applications; semiconductor doping; semiconductor process modelling; 1D modeling; Knoop hardness; amorphous layer; high dose rate effects; macro-material changes; micro-material changes; modeling; modulator circuit; object-oriented scheme; paradigm system; plasma dynamics; plasma source ion implantation; semiconductor doping; short term effort; stoichiometry; Circuits; Ion implantation; Object oriented databases; Object oriented modeling; Physics; Plasma immersion ion implantation; Plasma measurements; Plasma sources; Semiconductor device doping; Semiconductor process modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 1995. IEEE Conference Record - Abstracts., 1995 IEEE International Conference on
  • Conference_Location
    Madison, WI, USA
  • ISSN
    0730-9244
  • Print_ISBN
    0-7803-2669-5
  • Type

    conf

  • DOI
    10.1109/PLASMA.1995.531729
  • Filename
    531729